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Burn-in substrate and burn-in device

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专利名称:Burn-in substrate and burn-in device发明人:Kenichi Ol申请号:US10975015申请日:20041028

公开号:US20050116223A1公开日:20050602

专利附图:

摘要:Input and output of small-current signals between a mother board andsemiconductor devices subjected to a burn-in test are made via a device driving unit.Large-current main power is supplied via the device driving unit through bus bars withoutpassing through the mother board. In this way, the risk of burn-out in a burn-in substrateand burn-in sockets, and damages caused by a burn-out can be reduced even when itoccurs.

申请人:Kenichi Ol

地址:Osaka JP

国籍:JP

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