2. 无铅下级厂商管理2.12.22.32.42.52.62.72.82.92.103. Tin-Si
3. 锡-银-铜（Sn- Ag- Cu）合金工艺发展
3.13.23.33.43.53.63.73.83.93.103.113.123.133.144. Optim4. SnAgCu合金工艺的最佳化
4.14.24.35. Lead F
5. 无铅生产风险5.15.25.36. Comp
6. 部件MSL控制
6.16.26.35.45.57. \"Lead
7. 无铅通过/失败标准
7.17.27.37.47.58. Lead F
8. 无铅产品分离控制
8.18.28.38.48.58.68.78..19.29.39.49.510.110.210.310.410.510.611.111.211.311.411.512.112.212.312.4PCBA Quality Process AuditAdd a 'Y' to the Box if the Process Was AssessedPaste PrintingAudit CriterionDefinition of Lead FreeHave you received the \"General Specification for Allowable Levels of Lead (Pb) in Dell Products\"(Dell P/N D4394)?Do you agree with the definitions?您是否赞同此定义？Have you identified all parts that require exemption to the RoHS requirements with detailedinformation surrounding why the exemption is required?您是否能识别按照RoHS要求免税的所有部件，这些部件拥有为何要求免税的详细信息？Do you have an action plan for every part that is non-RoHS compliant and does not have anexemption?ead Free Sub-Tier Management2. 无铅下级厂商管理Does your company have a Corporate wide \"Lead Free\" specification that defines your companiesrequirements for \"Lead Free\" raw materials and finished product?您的公司是否拥有公司范围的\"无铅\"说明书，该说明书规定您公司对无铅原材料和成品的要求？Has a copy of your Corporate \"Lead Free\" specification been provided to Dell?您是否提供一份公司的\"无铅\"说明书给Dell？Have you established a complete list of your sub-tier suppliers to be used to track compliance with your\"Lead Free\" requirements?您是否已经建立一个亚级供应商的列表用于追踪是否符合您的无铅要求？Have you sent a copy of your \"Lead Free\" specification and requirements to all of your sub-tiersuppliers?您是否已将您的\"无铅\"说明书和要求发送到所有亚级供应商？Do you have an updated list of your sub-tier suppliers that acknowledge receipt of your \"Lead Free\"specification and requirements?您是否拥有收到您的\"无铅\"说明书和要求的亚级供应商的更新列表？Do you have an updated list that tracks the compliance status of each sub-tier supplier to your \"LeadFree\" specification and requirements?您是否有追踪各亚级供应商是否遵循您的\"无铅\"说明书和要求的更新列表？Do you have an Operating Procedure in place at your receiving or incoming inspection area thatdocuments procedures for verification of compliance with your \"Lead Free\" specification for incomingmaterials?您在接收或进厂检查区是否有合适的操作程序记录进入原料是否遵循无铅说明书的检查过程？Do you have records that demonstrate your Incoming Materials area is in compliance with theVerification operating procedure?您是否拥有表明进入原料区是否遵循检验操作程序的记录？Do you have analytical testing capability, either at your incoming inspection area or at a local 3rd partyanalytical testing vendor, available to perform testing on a sample basis to verify Lead Free complianceof incoming materials?您是否有分析检测能力，要么在进厂检查区，要么在当地第三方分析检验出售商，可以在样品基础上进行检测以检验进入原料的无铅符合情况？Can you define, control and provide traceability thereof for the solder alloy mix being used by your sub-tier suppliers?您是否可以规定、控制并有能力跟踪您的亚级供应商使用的焊接合金混合物？in-Silver-Copper (Sn-Ag-Cu) Alloy Process Development3. 锡-银-铜（Sn- Ag- Cu）合金工艺发展
Have you provided Dell a copy of the specifications on your Lead Free solder paste?您是否提供一份关于您的无铅焊锡膏的说明书给Dell？Have you completed a Design of Experiments (DOE) to evaluate multiple SnAgCu solder paste alloys,surface finishes, and process parameters for your SMT process?您是否完成实验设计（DOE）用以评估您的SMT加工的多种SnAgCu焊锡膏合金、表面修饰和工艺参数？Do you have DOE qualification data for your SnAgCu SMT process that meets the requirements of Dell's\"Lead Free Qualification Requirements\您是否拥有满足Dell\"无铅资格要求\"文件D4559的SnAgCu SMT工艺的DOE资格资料？Have you provided specifications on your Lead Free Wave Solder (Flow Solder) alloy?您是否已为您的无铅波动焊接（流动焊接）合金提供说明书？Have you provided specifications on your Lead Free Wave Solder (Flow Solder) flux?您是否已为您的无铅波动焊接（流动焊接）焊剂提供说明书？Have you completed a Design of Experiments (DOE) to evaluate multiple SnAgCu or SnCu solder alloys,surface finishes, and process parameters for your Wave Solder process?您是否完成实验设计（DOE）用以评估您的波动焊接工艺的多种SnAgCu或SnCu焊接合金、表面修饰和工艺参数？Do you have DOE qualification data for your SnAgCu or SnCu Wave Solder process that meets therequirements of Dell's \"Lead Free Qualification Requirements\您是否拥有满足Dell\"无铅资格要求\"文件D4559要求的SnAgCu或SnCu波动焊接工艺的DOE资格资料？Do you have documentation from your Wave Solder equipment vendor that verifies that the equipment iscompatible with the SnAgCu or SnCu alloy selected?您是否从波动焊接设备出售商那里获得检验该设备是否与选定的SnAgCu或SnCu合金一致的文档？Have you provided specifications on your Lead Free rework / repair solder alloy?您是否提供一份关于您的无铅再加工／修复焊接合金的说明书？Have you provided specifications on your Lead Free rework / repair flux?您是否提供一份关于您的无铅再加工／修复焊剂的说明书？Have you completed a Design of Experiments (DOE) to evaluate multiple SnAgCu solder alloys, surfacefinishes, and process parameters for your rework process for each major component form factor(BGA, QFP, 0603, PTH, etc.)?您是否已完成一个实验设计（DOE）用以为您的再加工处理每个主要部件波形因数（BGA、QFP、0603、PTH等）评估多种SnAgCu焊接合金、表面修饰以及工艺参数？Do you have DOE qualification data for each SnAgCu component rework process that meets therequirements of Dell's \"Lead Free Qualification Requirements\qualified as part of the SMT and Wave Solder process qualification as forced rework locations on thetest boards.您是否拥有满足Dell\"无铅资格要求\"文件D4559的每个SnAgCu部件再加工处理的DOE资格资料？ 再加工可作为检测板上的强制再加工区而成为SMT和波动焊接加工资格的一部分。Have you identified all new requirements for your Lead Free rework tool set, for each major componentpackage type? Examples would include a new type of rework tool, a different rework tool material ofconstruction, Nitrogen atmosphere requirement, etc.您是否已经辨别出无铅再加工成套工具、每种主要部件包装类型的所有新的要求？ 示例包括新型再加工工具、构造的不同再加工工具材料、氮气氛要求等。Have rework risks have been documented for each major component package type (board warpage,component delamination, etc.).是否已经为每个主要部件包装类型记录了再加工风险（板弯曲、部件分层等）？Optimization of SnAgCu Alloy Process4. SnAgCu合金工艺的最佳化Has each step of the assembly process (screen print, placement, reflow, fabrication, assembly, test,rework, etc.) been optimized by the use of a DOE or other statistical process tool?是否每级装配过程（丝网印刷、布局、回流、构造、装配、检测、再加工等）都使用DOE或其它统计处理工具进行优化？Are the DOE plans and results documented to support your optimized process settings?是否已记录DOE计划和结果以支持您的最佳化工艺设置？Are your optimized process and assembly settings documented in a procedure or specification?您的最佳化工艺和装配设置是否已记录在步骤或说明书中？ead Free manufacturing risks5. 无铅生产风险Have you identified and documented the key manufacturing and process risks that must be controlled inyour \"Lead Free\" manufacturing process (i.e. stencil design, PCBA design changes, temperature profileparameters, use of Nitrogen, inspection criteria, part number control, segregation from non-lead freematerials, etc.)?您是否辨别并记录必须在无铅制造工艺（即模板设计、PCBA设计更改、温度分布曲线参数、氮使用、检查标准、部件号码控制、从非无铅原料中分离）中控制的主要生产和工艺风险？Do you have risk mitigation control plans identified for each risk?您是否拥有每个风险的缓和控制计划？Are you providing Dell a monthly status on the implementation of each risk mitigation control plan?您是否为Dell提供执行各风险缓和控制计划的每月状况？Component MSL Controls6. 部件MSL控制Higher assembly and rework process temperatures will require components to be controlled at higherMSL levels. Do you have documentation that identifies the MSL levels for all \"Lead Free\" componentsand assemblies for your Optimized \"Lead Free\" assembly process?较高装配和再加工处理温度可能需要将部件控制在较高MSL水平上。 您是否拥有为您的最佳化无铅装配工艺辨别所有无铅部件和部件MSL水平的文档？Do you have procedures, equipment, storage facilities, etc. in place to implement the appropriatecontrols for each MSL level, per J-STD 020B?您是否有适当的步骤、设备、存储装置等用来为各MSL水平、J-STD 020B进行适当的控制？Do you have documentation or audit records to verify that the appropriate MSL controls are beingproperly implemented and controlled in your \"Lead Free\" assembly process?您是否拥有文档或检查记录来证实在无铅装配过程中合适的MSL控制正被正确执行和控制？Are MSL controls in place for components rejected from the SMT placement machines?适合的部件MSL控制是否被SMT布局机拒绝？Do you have MSL controls in place for your \"Lead Free\" rework / repair process?您是否拥有无铅再加工/修复处理的合适MSL控制？Lead Free\" pass / fail criteria7. 无铅通过/失败标准Has the pass / fail criteria for \"Lead Free\" assemblies been updated?无铅装配的通过/失败标准是否被更新？Have the inspection procedures been updated for the new \"Lead Free\" pass / fail criteria?对于新的无铅通过/失败标准，检查程序是否已被更新？Have the inspection and assembly training documentation been updated for the new \"Lead Free\" pass /fail criteria?对于新的无铅通过/失败标准，检查和装配培训文档是否已被更新？Have all Personnel been trained for Lead-Free solder joint inspection? Requires a copy of trainingdocumentation and instruction process?是否所有人员都对无铅焊点检查进行了培训？ 要求一份培训文档和说明处理？Does your lead free pass / fail criteria include criteria for identifying thermal damage of the PWB andcomponents?您的无铅通过/失败标准是否包括辨别PWB和部件热损坏的标准？ead Free Product Segregation Controls8. 无铅产品分离控制
Have all operating procedures and documentation been updated to include \"Lead Free\" product /materials segregation and handling requirements to prevent mixing \"Lead Free\" from \"Lead Containing\"product?是否所有作业程序和文档都被更新到包括无铅产品/原料分离和处理要求以防将无铅产品与含铅产品Have all labeling and marking documentation or specifications been updated to include \"Lead Free\"labeling and marking requirements?是否所有标签和标记文档或说明书都被更新到包括无铅标签和标记要求？Are all lead-free manufacturing, rework and storage areas for raw materials, WIP, and finished goodsclearly labeled and isolated from each other?是否所有原料、WIP和成品的无铅制造、再加工和存储区都被明显标记并彼此分离？Do you have audit requirements and results to verify compliance with your \"Lead Free\" segregation andlabeling procedures?您是否拥有检查要求和结果以检验与无铅分离和标记过程的符合性？Do you have a documented procedure to prevent returned \"Lead Free\" product (from Dellmanufacturing lines or Field returns) from being mixed with \"Lead Containing\" product?您是否拥有证明的方法来防止返回的无铅产品（从Dell生产线或场所返回）与含铅产品混合在一起？Is this procedure automated and not subject to failure caused by operator error?该方法是否为自动化并受操作者误差引起的故障的影响？If you use more than one alloy of Lead Free solder for SMT, Wave Solder, or rework, then you must haveprocedures and controls in place to identify and segregate products with each alloy. Are theseprocedures and controls in place?如果您为SMT、波动焊接或再加工使用不止一种无铅焊料合金，那么您必须具有合适的方法和控制用以辨别和分离带有各混合物的产品。 这些方法和控制合适吗？Do you have an identification / marking system in place to validate labeling of leaded and lead-freeassemblies prior to shipment? Reference Dell Inbound Packaging Specification P\\N 11500.您是否拥有合适的辨别/标记系统用来在装运前确认标记含铅和无铅组件。参考Dell入站包装说明P\\N 11500。Do you have a corporate specification requiring unique part numbers for Lead Free components andmaterials from your sub-tier suppliers?您是否拥有要求从您的亚级供应商获得无铅部件和原料的唯一部件号码的公司说明书？Do you have a corporate specification or procedure requiring a new part number for Lead Freeassemblies shipped to your customers?对于发送到您顾客的无铅组件，您是否拥有要求新的部件号码的公司说明书或方法？Have all for your internal BOM structures been modified to identify lead free components and materials?是否所有您的内部BOM构造都被更改以辨别无铅部件和原料？Have the updated Lead Free BOM's been released in your MRP system to drive requirements for LeadFree products per Dell's schedule?是否已在您的MRP系统中使用更新的无铅BOM来驱使每个Dell一览表的无铅产品的要求？Do all lead-free components and assemblies have unique part numbers from equivalent lead containingcomponents or assemblies?是否所有的无铅部件和组件都具有与同等含铅部件或组件不同的唯一部件号码？Have you identified any product design guideline changes required by your \"Lead Free\" assemblyprocess, test process, or lead free materials?您是否辨别无铅装配过程、检测过程或无铅原料需要的产品设计方针变化？Have these design changes been documented in a \"Lead Free\" design guide or specification?这些设计更改是否被记录在无铅设计指南或说明书中？Have you identified any assembly process design changes (such as a Solder Paste Stencil,support tooling, etc) for your \"Lead Free\" assembly and test process?您是否为无铅装配与测试处理辨别出任何装配过程设计更改（例如，焊锡膏模板、支持工具等）？Have these process design changes been documented in a procedure or specification?这些工艺设计改变是否已记录在程序或说明书中？Have you identified and documented your design rule for acceptability of lead free solder on ICTtest pads?Have you identified and documented the design rules for you lead free press fit componentassembly process?Have you identified and documented to Dell the optimum lead free surface finish for each of yourlead free assembly process flows (such as single sided SMT, double sided SMT, double sidedSMT with wave solder, etc.)?您是否已向Dell辨别和记录每个无铅装配流程的最佳无铅表面修饰（例如，单面SMT、双面SMT、Have you identified and documented the hold time rules established for each surface finishbetween each major thermal process step?您是否辨别并记录各个主要热过程步骤之间的表面修饰持续时间规则？Have you documented and implemented the appropriate physical handling procedures for eachPWB surface finish?Have you evaluated and qualified the PWB solder mask with your lead free assembly process?您是否评估并使无铅装配过程的PWB焊剂防护膜合格？Do you have the necessary handling controls in place to prevent Sulfur and / or acidcontamination of Immersion Silver plated PWB's? Reference MacDermid Assembly GuidelineTech Report No 209/309 and MacDermid Sterling Horizontal Process Operating Guide, Rev 20.您是否拥有合适的必须处理控制用以防止硫和/或酸污染浸入的镀银PWB？ 参照MacDermid装配准则技术报告209/309号和MacDermid Sterling横向处理操作指南，20版本。Have you qualified your ICT equipment / test probe set up with your lead free assembly process?您是否将ICT设备/测试探头安装合格用于无铅装配过程？Have you qualified all of your non-factory repair locations for Lead Free capability andcompliance?Have you qualified and documented your PWB impedance testing process with your lead freePWB's?Have you identified and documented the AOI inspection capability for your lead free assemblyprocess?1, 23, 45, 6
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