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专利名称：Adhesive for mold and its manufacturing
method
发明人：海川 善久,高間 智宏,石田 靖英申请号：JP2019036192申请日：20190228公开号：JP2020138220A公开日：20200903
专利附图：
摘要：Problem to be solved: to provide excellent heat resistance to heat of moltenmetal and to provide a method for producing a mold adhesive for mold and an adhesivefor mold to exhibit excellent adhesion even after a long period of time. Solution: as an
adhesive for mold used for bonding the molds 10a and 10B produced individually, aninorganic filler having a refractory temperature of sk15 or more and an average particlediameter of 0.1 to 20 Agents are prepared. Diagram
申请人：旭有機材株式会社
地址：宮崎県延岡市中の瀬町２丁目５９５５番地
国籍：JP
代理人：中島 三千雄,中島 正博
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