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专利名称：Quality control system发明人：森 弘之,西 貴行申请号：JP2014021287申请日：20140206公开号：JP6387620B2公开日：20180912
摘要：A quality control system for a surface mounting line includes a solder printingprocess of printing solder onto a printed circuit board using a solder printing apparatus,a mounting process of placing an electronic component on the printed circuit board usinga mounter, and a reflow process of soldering the electronic component using a reflowfurnace. The system includes a terminal detector, which generates terminal informationabout the position of a terminal of the electronic component placed on the printedcircuit board after the mounting process, and a mount inspection apparatus, whichidentifies the position of the terminal of the electronic component based on the terminalinformation and inspects the state of a solder joint between the terminal and the printedcircuit board after the reflow process.
申请人：オムロン株式会社
地址：京都府京都市下京区塩小路通堀川東入南不動堂町８０１番地
国籍：JP
代理人：世良 和信,和久田 純一,中村 剛
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